Title:
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, TERMINAL, BUSBAR, AND HEAT-DIFFUSING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/107093
Kind Code:
A1
Abstract:
This copper alloy is composed of: Mg at a content within a range of 70 to 400 mass ppm; Ag at a content within a range of 5 to 20 mass ppm; and Cu and inevitable impurities as the balance. The P content is less than 3.0 mass ppm, the average crystal grain diameter is within a range of 10 to 100 μｍ, the electrical conductivity is 90% IACS or greater, and the residual stress percentage is 50% or greater at 150℃ for 1,000 hours.
Inventors:
MATSUNAGA HIROTAKA (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
MATSUKAWA HIROYUKI (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
MATSUKAWA HIROYUKI (JP)
Application Number:
PCT/JP2020/044220
Publication Date:
June 03, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/02; C22F1/08; H01B1/02
Domestic Patent References:
| WO2019189558A1 | 2019-10-03 | |||
| WO2019189534A1 | 2019-10-03 |
Foreign References:
| JP2019178399A | 2019-10-17 | |||
| JP2019178398A | 2019-10-17 | |||
| JP2015086462A | 2015-05-07 | |||
| JP2019216546A | 2019-12-19 | |||
| JP2016056414A | 2016-04-21 |
Other References:
See also references of EP 4067516A1
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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