COPPER ALLOY PLATE FOR HEAT-DISSIPATION COMPONENT

WIPO Patent Application WO/2017/110759

A1

Provided is a copper alloy plate with which it is possible to impart adequate strength and heat-dissipation performance to a manufactured heat-dissipation component when a process for heating to a temperature of at least 650°C is included in part of a process for manufacturing the heat-dissipation component. The copper alloy plate contains 0.2-0.95% by mass of Ni, 0.05-0.8% by mass of Fe, and 0.03-0.2% by mass of P. Taking "[Ni+Fe]" to be the total Ni and Fe content and "[P]" to be the P content, the copper alloy plate comprises 0.25-1.0% by mass of [Ni+Fe], and the ratio [Ni+Fe]/[P] is 2-10, the balance being Cu and unavoidable impurities. This copper alloy plate has a 0.2% proof strength of at least 100 MPa and exceptional bendability. Once the copper alloy plate has been subjected to an aging process that includes heating at 850°C for 30 minutes, subsequent water cooling, and then heating at 500°C for two hours, the 0.2% proof strength is at least 120 MPa or higher, and the conductivity is at least 40% IACS.

JP5672939	Cables for moving parts and their manufacturing methods
WO/2001/005585	COMPOSITE METAL COIL OR SHEET AND MANUFACTURING METHOD FOR SAME
WO/2012/132765	CU-SI-CO-BASE COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR PRODUCING SAME

HASHIMOTO DAISUKE
NISHIMURA MASAYASU

PCT/JP2016/087840

June 29, 2017

December 19, 2016

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KOBE STEEL LTD (JP)

C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01L23/373; C22F1/00

WO2016158607A1	2016-10-06
WO2016152648A1	2016-09-29

JP2013231224A	2013-11-14
JP2001335864A	2001-12-04
JPS602638A	1985-01-08
JPH093571A	1997-01-07
JPH06177289A	1994-06-24

SAMEJIMA, Mutsumi et al. (JP)

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