Title:
COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND METHODS RESPECTIVELY FOR MANUFACTURING THESE PRODUCTS
Document Type and Number:
WIPO Patent Application WO/2020/137726
Kind Code:
A1
Abstract:
A copper alloy plate which contains, at the thickness center thereof as observed in the plate thickness direction, 0.3 to 1.2% by mass inclusive of Mg and 0.001 to 0.2% by mass inclusive of P, with the remainder made up by Cu and unavoidable impurities, wherein the copper alloy plate has such a surface layer part that the Mg concentration in the plate surface is 30% or less of the bulk Mg concentration at the thickness center and the surface layer part has a depth at which the Mg concentration is 90% of the bulk Mg concentration as observed from the plate surface, and the Mg concentration in the surface layer part increases from the plate surface toward the thickness center at a concentration gradient of 1.8 to 50% by mass/μm inclusive.
Inventors:
MIYAJIMA NAOKI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
KUBOTA KENJI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
KUBOTA KENJI (JP)
Application Number:
PCT/JP2019/049547
Publication Date:
July 02, 2020
Filing Date:
December 18, 2019
Export Citation:
Assignee:
MITSUBISHI SHINDO KK (JP)
MITSUBISHI MATERIALS CORP (JP)
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/08; C25D5/10; C25D5/50; B23K35/26; C22C13/00; C22F1/00
Foreign References:
| JP2016166397A | 2016-09-15 | |||
| JP2014095107A | 2014-05-22 | |||
| JP2014047378A | 2014-03-17 | |||
| JP2012007231A | 2012-01-12 | |||
| JP2018243431A | 2018-12-26 | |||
| JP2019114466A | 2019-07-11 | |||
| JPH09157774A | 1997-06-17 | |||
| JP4516154B1 | 2010-08-04 | |||
| JP2012007231A | 2012-01-12 | |||
| JP2014047378A | 2014-03-17 |
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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