Title:
COPPER ALLOY AND PROCESS FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/069318
Kind Code:
A1
Abstract:
This copper alloy contains 5.00 to 8.00at% of Zr, and comprises both Cu and a Cu-Zr compound, wherein: neither of the two phases of Cu and the Cu-Zr compound contains a eutectic phase; and when the copper alloy is viewed cross-sectionally, the two phases form a mosaic texture where crystals of 10μm or less in size are dispersed. The copper alloy is manufactured by a process which includes a sintering step for applying pulsed direct current to a Cu-Zr binary alloy powder, which has an average particle diameter of 30μm or less and a hypo-eutectic composition containing 5.00 to 8.00at% of Zr, at a temperature of 0.9Tm°C or lower (wherein Tm (°C) is the melting point of the alloy powder), and thus conducting the spark plasma sintering of the powder. The Cu-Zr compound may be Cu5Zr, Cu9Zr2 and/or Cu8Zr3.
Inventors:
GOTO TAKASHI (JP)
KIMURA HISAMICHI (JP)
INOUE AKIHISA (JP)
MURAMATSU NAOKUNI (JP)
KIMURA HISAMICHI (JP)
INOUE AKIHISA (JP)
MURAMATSU NAOKUNI (JP)
Application Number:
PCT/JP2013/078794
Publication Date:
May 08, 2014
Filing Date:
October 24, 2013
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
UNIV TOHOKU (JP)
UNIV TOHOKU (JP)
International Classes:
C22C9/00; B22F1/00; B22F3/14; B22F3/24; C22F1/08; H01B1/02; H01B13/00; C22F1/00
Domestic Patent References:
| WO2011030898A1 | 2011-03-17 | |||
| WO2011030898A1 | 2011-03-17 | |||
| WO2011030899A1 | 2011-03-17 |
Foreign References:
| JP2005281757A | 2005-10-13 | |||
| JP2000160311A | 2000-06-13 | |||
| JP2005281757A | 2005-10-13 |
Other References:
"Electrical and mechanical properties of Cu-4.5 at. % Zr alloy produced by powder metallurgy", COPPER AND COPPER ALLOY, vol. 50, 1 August 2011 (2011-08-01), pages 75 - 79, XP008179096
"Microstructures and Mechanical and Electrical Properties of Wires Drawn from Hypoeutectic Cu-Zr Alloys Preprocessed by Spark Plasma Sintering", COPPER AND COPPER ALLOY, vol. 52, 1 August 2013 (2013-08-01), pages 231 - 235, XP055251975
D. ARIAS; J.P. ABRIATA, BULL, ALLOY PHASE DIAGRAM, vol. 11, 1990, pages 452 - 459
See also references of EP 2915890A4
"Microstructures and Mechanical and Electrical Properties of Wires Drawn from Hypoeutectic Cu-Zr Alloys Preprocessed by Spark Plasma Sintering", COPPER AND COPPER ALLOY, vol. 52, 1 August 2013 (2013-08-01), pages 231 - 235, XP055251975
D. ARIAS; J.P. ABRIATA, BULL, ALLOY PHASE DIAGRAM, vol. 11, 1990, pages 452 - 459
See also references of EP 2915890A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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