COPPER ALLOY AND PROCESS FOR PRODUCING THE SAME

WIPO Patent Application WO/2006/109801

A1

[PROBLEMS] To provide a beryllium-free copper alloy satisfactory in various performances. [MEANS FOR SOLVING PROBLEMS] The copper alloy has a given chemical composition, the remainder consisting of copper and impurities. In the copper alloy, the crystal structure has an aspect ratio of 5 or lower and the total number of precipitates and inclusions having a particle diameter of 1 µm or larger satisfies the following relationship (1). This copper alloy is obtained by melting, casting, subsequently cooling the cast at a rate of 1 °C/sec or higher at least in the temperature range of from the temperature of the cast immediately after the casting to 900°C, and subjecting the cast to a solution heat treatment and/or hot rolling. logN≤0.4742+17.629×exp(-0.1133×X) (1) In the relationship (1), N is the total number of the precipitates and inclusions per unit area (mm²) and X is the particle diameter of the precipitates and inclusions (µm).

NAGAMICHI TSUNEAKI (JP)
MAEHARA YASUHIRO (JP)
YOSHIDA NAOTSUGU (JP)
YONEMURA MITSUHARU (JP)
NAKAJIMA KEIJI (JP)

PCT/JP2006/307658

October 19, 2006

April 11, 2006

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SUMITOMO METAL IND (JP)
NAGAMICHI TSUNEAKI (JP)
MAEHARA YASUHIRO (JP)
YOSHIDA NAOTSUGU (JP)
YONEMURA MITSUHARU (JP)
NAKAJIMA KEIJI (JP)

C22C9/00; B21B3/00; B22D11/00; B22D11/124; C22F1/08; C22F1/00; H01B1/02

JP2004307905A	2004-11-04
JP2005290543A	2005-10-20
JP2005281850A	2005-10-13
JP2005113259A	2005-04-28
JP2005307334A	2005-11-04
US20020119071A1	2002-08-29
US20020127133A1	2002-09-12
JPH06184666A	1994-07-05
JPS63143230A	1988-06-15
JPH04231447A	1992-08-20

Honoue, Terutada (Amagasaki Building 5-17-23, Higashinaniwa-ch, Amagasaki-shi Hyogo, JP)

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