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Title:
COPPER ALLOY SEAMLESS TUBE FOR HEAT TRANSFER TUBE
Document Type and Number:
WIPO Patent Application WO/2014/142049
Kind Code:
A1
Abstract:
A copper alloy seamless tube for a heat transfer tube, obtained by processing a copper alloy and characterized in that: the copper alloy contains Sn and, by mass, 0.01 to 0.08% of Zr and 0.004 to 0.04% of P, with the remainder being made up by Cu and unavoidable impurities; the amount of Sn and Zr contained in the copper alloy satisfies the following relationship (1): (1) 0.4 ≤ A + 2B ≤ 0.85 (where A represents the Sn content (mass%) and B represents the Zr content (mass%)); and the electrical conductivity of the copper alloy seamless tube for a heat transfer tube satisfies the following relationship (2): (2) ρ2-ρ1 ≥ 0.3 (%IACS)(where ρ1 represents the electrical conductivity (%IACS) after solution treatment and ρ2 represents the electrical conductivity (%IACS) after aging treatment). According to the present invention, it is possible to provide a copper alloy seamless tube for a heat transfer tube having high strength, little decrease in strength caused by brazing, high creep deformation resistance characteristics, and a high effect of suppressing intermediate temperature brittleness.

Inventors:
ANDO TETSUYA (JP)
Application Number:
PCT/JP2014/056110
Publication Date:
September 18, 2014
Filing Date:
March 10, 2014
Export Citation:
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Assignee:
UACJ CORP (JP)
International Classes:
C22C9/02; B21C23/00; B21C23/08; C22F1/08; C22F1/00
Foreign References:
JP2010222692A2010-10-07
JP2008255381A2008-10-23
JP2011246802A2011-12-08
JP2011184775A2011-09-22
Attorney, Agent or Firm:
AKATSUKA Kenji et al. (JP)
Kenji Akatsuka (JP)
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