Title:
COPPER ALLOY SHEET HAVING EXCELLENT HEAT RESISTANCE AND HEAT DISSIPATION
Document Type and Number:
WIPO Patent Application WO/2019/078474
Kind Code:
A1
Abstract:
The present invention provides a high-strength copper alloy sheet having high heat resistance and high heat dissipation characteristics, and a manufacturing method therefor, the sheet being suitable for: a material for a shield can for the heat dissipation of a mobile device; a lead frame material for automobiles and other semiconductors; and a material for electric and electronic parts such as connectors, relays and switches to be used across all industries including vehicles.
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Inventors:
KWAK WON SHIN (KR)
JEONG MIN JAE (KR)
HONG HYE MIN (KR)
JEONG MIN JAE (KR)
HONG HYE MIN (KR)
Application Number:
PCT/KR2018/009778
Publication Date:
April 25, 2019
Filing Date:
August 24, 2018
Export Citation:
Assignee:
POONGSAN CORP (KR)
International Classes:
C22C9/00; B21B3/00; C22F1/08
Foreign References:
| JP2008266787A | 2008-11-06 | |||
| JP2009167450A | 2009-07-30 | |||
| JPH10168532A | 1998-06-23 | |||
| JP2012077362A | 2012-04-19 | |||
| JP2008056977A | 2008-03-13 |
Attorney, Agent or Firm:
KIM, Yong In et al. (KR)
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