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Title:
COPPER ALLOY SHEET MATERIAL HAVING LOW YOUNG'S MODULUS AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2011/068134
Kind Code:
A1
Abstract:
Disclosed is a copper alloy sheet material for an electrical/electronic component, which has low Young's modulus that is required for an electrical/electronic component such as a connector. The copper alloy sheet material for an electrical/electronic component has an alloy composition containing 0.5-5.0% by mass of Ni and/or Co in total and 0.2-1.5% by mass of Si, with the balance made up of Cu and unavoidable impurities. The copper alloy sheet material for an electrical/electronic component has a 0.2% proof stress in the rolling direction of not less than 500 MPa, a conductivity of not less than 30% IACS, a Young's modulus of not more than 110 GPa and a bending/flexure coefficient of not more than 105 GPa.

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Inventors:
SATO, Koji (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
佐藤　浩二 (〒22 東京都千代田区丸の内２丁目２番３号　古河電気工業株式会社内 Tokyo, 〒1008322, JP)
KANEKO, Hiroshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
Application Number:
JP2010/071517
Publication Date:
June 09, 2011
Filing Date:
December 01, 2010
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 〒1008322, JP)
古河電気工業株式会社 (〒22 東京都千代田区丸の内２丁目２番３号 Tokyo, 〒1008322, JP)
SATO, Koji (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
佐藤　浩二 (〒22 東京都千代田区丸の内２丁目２番３号　古河電気工業株式会社内 Tokyo, 〒1008322, JP)
International Classes:
C22C9/06; B21B3/00; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; H01B13/00; C22F1/00
Attorney, Agent or Firm:
IIDA, Toshizo et al. (ISHII Bldg. 3F, 1-10 Shimbashi 3-chome, Minato-k, Tokyo 04, 〒1050004, JP)
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