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Title:
COPPER ALLOY SHEET MATERIAL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/213224
Kind Code:
A1
Abstract:
Provided are: a copper alloy sheet material which has excellent bendability while maintaining high strength, also has excellent stress corrosion cracking resistance and stress relaxation resistance properties, and is inexpensive; and a method for manufacturing the copper alloy sheet material. A copper alloy sheet material is manufactured, which has a composition comprising 17 to 32% by mass of Zn, 0.1 to 4.5% by mass of Sn, 0.5 to 2.5% by mass of Si, 0.01 to 0.3% by mass of P and a remainder made up by Cu and unavoidable impurities, wherein the sum total of a value produced by sextupling the P content and the Si content is 1% by mass or more, and the copper alloy sheet material has such crystal orientation that the I{220}/I{420} value falls within the range from 2.5 to 8.0 wherein I{220} represents the X-ray diffraction intensity of {220} crystal plane and I{420} represents the X-ray diffraction intensity of {420} crystal plane in a sheet surface of the copper alloy sheet material.

Inventors:
YOSHIDA KAZUKI (JP)
SUGIMOTO TAKANOBU (JP)
AOYAMA TOMOTSUGU (JP)
NARIEDA HIROTO (JP)
Application Number:
PCT/JP2020/003320
Publication Date:
October 22, 2020
Filing Date:
January 30, 2020
Export Citation:
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Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C22F1/00; C22C9/04; C22F1/08; H01B1/02; H01B13/00; H01R13/03
Foreign References:
JP2018070944A2018-05-10
JPH04224645A1992-08-13
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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