Title:
COPPER ALLOY SHEET MATERIAL AND METHOD FOR MANUFACTURING SAME, ELECTRONIC COMPONENT, AND RAISING-PROCESSED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/106262
Kind Code:
A1
Abstract:
Provided are a copper alloy sheet material and a method for manufacturing same, which enable obtaining of high tensile strength and excellent raising processability. This copper alloy sheet material has an alloy composition including Ni and/or Co in a range of 1.00-5.00 mass% and Si in a range of 0.20-1.50 mass%, the remaining portion being Cu and unavoidable impurities, and has a tensile strength of 550 MPa or more. In the copper alloy sheet material, the area proportion of crystal grains, having a GAM value obtained from crystal orientation analysis data of SEM-EBSD method in a range of 0.1°-0.8°, is in a range of 30-90%.
Inventors:
AKIYA SHUNTA (JP)
AMEMIYA YUUTAROU (JP)
KAWATA SHINGO (JP)
SUGAHARA CHIKAHITO (JP)
TAKAZAWA TSUKASA (JP)
AMEMIYA YUUTAROU (JP)
KAWATA SHINGO (JP)
SUGAHARA CHIKAHITO (JP)
TAKAZAWA TSUKASA (JP)
Application Number:
PCT/JP2022/044745
Publication Date:
June 15, 2023
Filing Date:
December 05, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/06; C22C9/10; C22F1/08; C22F1/00
Domestic Patent References:
| WO2017168803A1 | 2017-10-05 |
Foreign References:
| JP2012136726A | 2012-07-19 | |||
| JP2018162510A | 2018-10-18 | |||
| JP2015101760A | 2015-06-04 | |||
| JP2016180131A | 2016-10-13 | |||
| JP2012122114A | 2012-06-28 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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