Title:
COPPER ALLOY SHEET MATERIAL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/140314
Kind Code:
A1
Abstract:
Provided are: a copper alloy sheet material that allows line tension to be set to a high level and that achieves good bending workability; and a method for manufacturing the copper alloy sheet material. This copper alloy sheet material includes an alloy composition that contains a total of 1.0–5.0% by mass of nickel and/or cobalt and 0.10–1.50% by mass of silicon, the remainder comprising copper and unavoidable impurities. In a reverse pole figure showing crystal orientation strength distribution of cross-sections parallel to both a rolling direction and a sheet-thickness direction, obtained from SEM-EBSD crystal orientation analysis data, the degree of integration of crystal grains with an orientation (001), which is parallel to the rolling direction, is at least 8.0, and the degree of integration of crystal grains with an orientation having a Shmid factor of at least 0.49 in a sheet-width direction perpendicular to the rolling direction is at least 3.0.
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Inventors:
KAWATA SHINGO (JP)
AKIYA SHUNTA (JP)
TAKAZAWA TSUKASA (JP)
AKIYA SHUNTA (JP)
TAKAZAWA TSUKASA (JP)
Application Number:
PCT/JP2023/001476
Publication Date:
July 27, 2023
Filing Date:
January 19, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/06; C22C9/10; C22F1/00; C22F1/08
Domestic Patent References:
| WO2011068134A1 | 2011-06-09 | |||
| WO2012026611A1 | 2012-03-01 |
Foreign References:
| JP2008223136A | 2008-09-25 | |||
| JP2013040399A | 2013-02-28 | |||
| JP2019157153A | 2019-09-19 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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