Title:
COPPER ALLOY SHEET MATERIAL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/186107
Kind Code:
A1
Abstract:
Provided are: a copper alloy sheet material having excellent press blanking workability, proof stress, bending workability, and conductivity and being applicable to micro-terminals; and a production method therefor. A copper alloy sheet material and a production method therefor, said copper alloy sheet material: containing 1.%-5.0% by mass Ni, 0.1%-2.0% by mass Si; containing at least one type selected from the group consisting of 0%-0.5% by mass Sn, 0%-1.0% by mass Zn, 0%-0.2% by mass Mg, 0%-0.15% by mass Mn, 0%-0.2% by mass Cr, 0%-1.5% by mass Co, 0%-0.02% by mass Fe, and 0%-0.1% by mass Ag, with the remainder being copper and unavoidable impurities; having 3-50 crystal grains distributed per 60 µm2, said crystal grains having an orientation that is offset no more than 15° from the S orientation {321}<3-46> in crystal orientation analysis by electron backscatter diffractometry, in a plane at a position at half the thickness of the sheet and parallel to the rolling surface; and having an average crystal grain area of 1.0-300 µm2 for crystal grains having an orientation that is offset no more than 15° from the S orientation {231}<3-46>.
Inventors:
ISOMATSU TAKEMI (JP)
HIGUCHI MASARU (JP)
HIGUCHI MASARU (JP)
Application Number:
PCT/JP2016/064597
Publication Date:
November 24, 2016
Filing Date:
May 17, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/06; B21B1/38; B21B3/00; C22C9/10; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00
Domestic Patent References:
| WO2010047373A1 | 2010-04-29 | |||
| WO2014126047A1 | 2014-08-21 |
Foreign References:
| JP2015034328A | 2015-02-19 | |||
| JP2007119845A | 2007-05-17 | |||
| JP2014015679A | 2014-01-30 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
飯田 敏三 (JP)
飯田 敏三 (JP)
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