Title:
COPPER ALLOY SHEET AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/171951
Kind Code:
A1
Abstract:
Provided are an inexpensive copper alloy sheet having excellent bendability as well as excellent stress corrosion cracking resistance and stress relaxation resistance characteristics while maintaining high strength, and a method for manufacturing the same. In the copper alloy sheet, which has a composition consisting of 17-32 mass% Zn, 0.1-4.5 mass% Sn, 0.5-2.0 mass% Si, and 0.01-0.3 mass% P, and the balance Cu and unavoidable impurities, the sum of six times the P content and the Si content is at least 1 mass% and, if the X-ray diffraction intensity of the｛220｝ crystal planes in the surface of the copper alloy sheet is represented as I｛220｝ and the X-ray diffraction intensity of the｛420｝ crystal planes is represented as I｛420｝, the sheet has a crystal orientation that satisfies I｛220｝/ I｛420｝≤ 2.0.
Inventors:
HIGAMI NAOTA (JP)
SUGIMOTO TAKANOBU (JP)
YOSHIDA KAZUKI (JP)
NARIEDA HIROTO (JP)
SUGIMOTO TAKANOBU (JP)
YOSHIDA KAZUKI (JP)
NARIEDA HIROTO (JP)
Application Number:
PCT/JP2019/006273
Publication Date:
September 12, 2019
Filing Date:
February 20, 2019
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C22C9/04; C22F1/08; H01B1/02; H01B5/02; H01B13/00; H01R13/03; C22F1/00
Domestic Patent References:
| WO2004022805A1 | 2004-03-18 |
Foreign References:
| JP2009062610A | 2009-03-26 | |||
| JP2018070944A | 2018-05-10 |
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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