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Title:
COPPER ALLOY SHEET, METHOD FOR MANUFACTURING SAME, DRAWING PRODUCT, ELECTRIC/ELECTRONIC COMPONENT MEMBER, ELECTROMAGNETIC SHIELD MATERIAL, AND HEAT DISSIPATION COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/121775
Kind Code:
A1
Abstract:
A copper alloy sheet according to the present invention has a composition containing 1.0-5.0 mass% in total of at least one among Ni and Co, and 0.1-1.5 mass% of Si, with the remainder comprising Cu and inevitable impurities, and has a conductivity of at least 38% IACS, wherein, for three types of test specimens respectively cut in a direction parallel to the rolling direction, a direction at 45° to the rolling direction, and a direction perpendicular to the rolling direction, the arithmetic mean value Aave. is in the range of 4.0-13.0 GPa·% as calculated by substituting values obtained from nominal stress-nominal strain curves obtained from tensile tests, and values of Cube azimuth area ratios obtained by the electron backscatter diffraction (EBSD) method into specific equation 1 to determine the values of A0°, A45°, and A90° for respective directions of parameter Ax (x: 0°, 45°, 90°), and substituting the determined values of A0°, A45°, and A90° for respective directions into specific equation 2. According to the present invention, excellent drawability can be reliably obtained without compromising the basic properties (in particular, heat dissipation) of conventional copper alloy sheets.

Inventors:
AKIYA SHUNTA (JP)
HIGUCHI MASARU (JP)
Application Number:
PCT/JP2019/045712
Publication Date:
June 18, 2020
Filing Date:
November 21, 2019
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C9/10; C22F1/08; C22F1/00
Domestic Patent References:
WO2009148101A12009-12-10
WO2016006053A12016-01-14
Foreign References:
JP2011231393A2011-11-17
JP2008095186A2008-04-24
JP2018062705A2018-04-19
JP2007314850A2007-12-06
JP2017089003A2017-05-25
Attorney, Agent or Firm:
SAITO Takuya et al. (JP)
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