Title:
COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHODS FOR PRODUCING THESE
Document Type and Number:
WIPO Patent Application WO/2021/025071
Kind Code:
A1
Abstract:
Provided is a copper alloy sheet in which a central part in the sheet thickness direction contains more than 2.0% (mass%; hereinafter the same) and not more than 32.5% of Zn, 0.1-0.9% of Sn, not less than 0.05% and less than 1.0% of Ni, not less than 0.001% and less than 0.1% of Fe and 0.005-0.1% of P, with the remainder comprising Cu and unavoidable impurities. The surface Zn concentration at a surface of the sheet is 60% or less of the central Zn concentration in a central part of the sheet. The sheet has a surface part having a depth up to a position where the Zn concentration reaches 90% of the central Zn concentration. In the surface part, the Zn concentration increases from the surface to the central part in the sheet thickness direction at a concentration gradient of 10-1000 mass%/μm.
Inventors:
MORIKAWA KENJI (JP)
MIYASHIMA NAOKI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
MIYASHIMA NAOKI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
Application Number:
PCT/JP2020/030058
Publication Date:
February 11, 2021
Filing Date:
August 05, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/04; C25D5/10; C25D5/34; C25D5/50; C25D7/00; C22C13/00
Foreign References:
| JP2007084923A | 2007-04-05 | |||
| JP2015160994A | 2015-09-07 | |||
| JP2007051370A | 2007-03-01 | |||
| JP2003160829A | 2003-06-06 | |||
| JPH02125830A | 1990-05-14 | |||
| JP2019144181A | 2019-08-29 | |||
| JPH0533087A | 1993-02-09 | |||
| JP2006283060A | 2006-10-19 | |||
| JP3953357B2 | 2007-08-08 | |||
| JP3717321B2 | 2005-11-16 | |||
| JPS533678B2 | 1978-02-08 |
Other References:
See also references of EP 4012059A4
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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