Title:
COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/117698
Kind Code:
A1
Abstract:
Provided is a copper alloy sheet in which surface discoloration or an increase in contact electric resistance is suppressed, and the copper alloy sheet has excellent plating film adhesion, by a configuration in which the center Mg concentration in a center section in the sheet thickness direction of the copper alloy sheet is 0.1 to less than 0.3 mass%, the center P concentration is 0.001-0.2 mass% inclusive, and the remainder comprises Cu and unavoidable impurities, the surface Mg concentration at the surface of the copper alloy sheet is 70% or less of the center Mg concentration, a surface layer section set at a predetermined depth from the surface has a concentration gradient in which the Mg concentration increases at 0.05-5 mass%/µm inclusive from the surface to the center section in the sheet thickness direction, and the maximum Mg concentration in the surface layer section is 90% of the center Mg concentration.
Inventors:
AKISAKA YOSHIKI (JP)
MIYASHIMA NAOKI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
MIYASHIMA NAOKI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
Application Number:
PCT/JP2020/045576
Publication Date:
June 17, 2021
Filing Date:
December 08, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08; C25D5/10; C25D5/34; C25D5/50
Domestic Patent References:
| WO2019189558A1 | 2019-10-03 |
Foreign References:
| JP2019178399A | 2019-10-17 | |||
| JP2019178398A | 2019-10-17 | |||
| JP2016166397A | 2016-09-15 | |||
| JP2014095107A | 2014-05-22 | |||
| JP2014047378A | 2014-03-17 | |||
| JP2012007231A | 2012-01-12 | |||
| JP2019222646A | 2019-12-10 | |||
| JP2017101283A | 2017-06-08 | |||
| JP2014047378A | 2014-03-17 |
Other References:
See also references of EP 4074848A4
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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