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Title:
COPPER ALLOY, COPPER ALLOY THIN SHEET AND COPPER ALLOY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/020187
Kind Code:
A1
Abstract:
This copper alloy contains 1.5 mass% to 2.7 mass% Fe, 0.008 mass% to 0.15 mass% P, and 0.01 mass% to 0.5 mass% Zn, with the remainder being Cu and unavoidable impurities. The content of C contained as an unavoidable impurity is less than 3 mass/mass ppm.

Inventors:
MAKI KAZUNARI (JP)
SUEHIRO KENICHIRO (JP)
ARISAWA SHUHEI (JP)
Application Number:
PCT/JP2014/070981
Publication Date:
February 12, 2015
Filing Date:
August 08, 2014
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
MITSUBISHI SHINDO KK (JP)
International Classes:
C22C9/00; B22D21/00; C22F1/00
Foreign References:
JP2001158927A2001-06-12
JP2000144284A2000-05-26
JP2010126783A2010-06-10
JPH10130755A1998-05-19
JPH07242965A1995-09-19
JPH11323464A1999-11-26
JPH11350055A1999-12-21
Other References:
See also references of EP 3031937A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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