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Patent Searching and Data


Title:
COPPER ALLOY WIRE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/199906
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper alloy wire material having high tensile strength, high flexibility, high conductivity and high bending fatigue resistance at the same time. This copper alloy wire material is characterized in that: the copper alloy wire material has a chemical composition consisting of 0.1-6.0% by mass of Ag and 0-20 ppm by mass of P with the remainder copper and inevitable impurities; and in a cross section parallel to the longitudinal direction of the wire material, the number density of secondary phase particles having an aspect ratio of 1.5 or more and a dimension in a direction perpendicular to the longitudinal direction of the wire material of 200 nm or less is 1.4 particles/µm2 or more.

Inventors:
SEKIYA Shigeki (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
FUJIWARA Hidemichi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
MITOSE Kengo (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
Application Number:
JP2017/018185
Publication Date:
November 23, 2017
Filing Date:
May 15, 2017
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 〒1008322, JP)
International Classes:
C22C9/00; B21C1/00; H01B1/02; H01B5/02; C22F1/00; C22F1/08
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (Sonderhoff & Einsel Law and Patent Office, Shin-Marunouchi Center Building 6-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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