Title:
COPPER ALLOY WIRE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/199906
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper alloy wire material having high tensile strength, high flexibility, high conductivity and high bending fatigue resistance at the same time. This copper alloy wire material is characterized in that: the copper alloy wire material has a chemical composition consisting of 0.1-6.0% by mass of Ag and 0-20 ppm by mass of P with the remainder copper and inevitable impurities; and in a cross section parallel to the longitudinal direction of the wire material, the number density of secondary phase particles having an aspect ratio of 1.5 or more and a dimension in a direction perpendicular to the longitudinal direction of the wire material of 200 nm or less is 1.4 particles/µm2 or more.
Inventors:
SEKIYA SHIGEKI (JP)
FUJIWARA HIDEMICHI (JP)
MITOSE KENGO (JP)
FUJIWARA HIDEMICHI (JP)
MITOSE KENGO (JP)
Application Number:
PCT/JP2017/018185
Publication Date:
November 23, 2017
Filing Date:
May 15, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/00; B21C1/00; H01B1/02; H01B5/02; C22F1/00; C22F1/08
Domestic Patent References:
| WO2014007258A1 | 2014-01-09 |
Foreign References:
| JP2002241872A | 2002-08-28 | |||
| JP2011146352A | 2011-07-28 | |||
| JP2000199042A | 2000-07-18 | |||
| JP2004190047A | 2004-07-08 | |||
| JP2009280860A | 2009-12-03 | |||
| JP2011246802A | 2011-12-08 | |||
| JPH02270945A | 1990-11-06 | |||
| JP2008081834A | 2008-04-10 | |||
| JP2008248275A | 2008-10-16 | |||
| JP2015114320A | 2015-06-22 | |||
| JPS5713230B2 | 1982-03-16 |
Other References:
See also references of EP 3460080A4
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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