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Title:
COPPER ALLOY WIRE AND PROCESS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2011/030898
Kind Code:
A1
Abstract:
Disclosed is a copper alloy wire (10) which has an alloy composition containing 3.0-7.0 at.% zirconium and which comprises a base copper phase (30) and a composite phase (20) composed of a copper-zirconium compound phase (22) and a copper phase (21). The base copper phase (30) and the composite phase (20) constitute a base phase-composite phase fibrous structure as shown in figure 1. In a section which is parallel to the axial direction and includes the axis, the base copper phase (30) and the composite phase (20) have been alternately arranged parallel to the axial direction. In the composite phase (20), the copper-zirconium compound phase (22) and the copper phase (21) constitute a fibrous structure within the composite phase, and in the section, the copper-zirconium compound phase (22) and the copper phase (21) have been alternately arranged parallel to the axial direction at phase intervals of 50 nm or narrower. The copper alloy wire has the double fibrous structure described above, which is in a dense fibrous state. It is thought that a reinforcement mechanism is hence produced as if the mixture law in fiber-reinforced composite materials holds.

Inventors:
MURAMATSU, Naokuni (2-56, Suda-cho, Mizuho-ku, Nagoya-cit, Aichi 30, 〒4678530, JP)
村松 尚国 (〒30 愛知県名古屋市瑞穂区須田町2番56号 日本碍子株式会社内 Aichi, 〒4678530, JP)
KIMURA, Hisamichi (2-1-1 Katahira Aoba-ku, Sendai-sh, Miyagi 77, 〒9808577, JP)
Application Number:
JP2010/065767
Publication Date:
March 17, 2011
Filing Date:
September 13, 2010
Export Citation:
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Assignee:
NGK INSULATORS, LTD. (2-56, Suda-cho Mizuho-ku, Nagoya-cit, Aichi 30, 〒4678530, JP)
日本碍子株式会社 (〒30 愛知県名古屋市瑞穂区須田町2番56号 Aichi, 〒4678530, JP)
Tohoku University (2-1-1 Katahira, Aoba-ku Sendai-sh, Miyagi 77, 〒9808577, JP)
国立大学法人東北大学 (〒77 宮城県仙台市青葉区片平2-1-1 Miyagi, 〒9808577, JP)
MURAMATSU, Naokuni (2-56, Suda-cho, Mizuho-ku, Nagoya-cit, Aichi 30, 〒4678530, JP)
International Classes:
C22C9/00; B22D11/059; B22D21/00; C22F1/08; H01B1/02; H01B5/02; H01B13/00; B22D11/00; C22F1/00
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (Pola-Nagoya Bldg, 9-26 Sakae 2-chome, Naka-ku, Nagoya-sh, Aichi 08, 〒4600008, JP)
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