COPPER ALLOY WIRE AND COPPER ALLOY SPRING

Title:

COPPER ALLOY WIRE AND COPPER ALLOY SPRING

Document Type and Number:

WIPO Patent Application WO/2012/081571

Kind Code:

A1

Abstract:

A high-strength and high-conductivity copper alloy wire and a copper alloy spring made from the copper alloy wire are provided. The copper alloy wire is a copper alloy filamentary material containing, in percent by mass, 3.0 to 15.0% Ni, 0.5 to 5.0% Al, and 0.1 to 3.0% Si, with the remainder being composed of Cu and incidental impurities, and is provided with a tensile strength (σB) of 900 to 1300 Mpa, and electrical conductivity of 10 to 22% IACS. In addition to the abovementioned characteristics, the copper alloy wire satisfies a strength ratio of A : B : C of 1 : 1.2 to 6.0 : 2 to 8.0 when A, B and C represent the diffraction intensities of Cu (111), Cu (200) and Cu (220) according to X-ray diffraction in a prescribed cross section. By using the copper alloy wire as a copper alloy spring that can be used for a conductive spring that can cope with heat sagging, the copper alloy spring can be incorporated in mobile phones and various electronic devices etc., and used as an operation or contact spring etc. The copper spring wire does not contain harmful elements such as Be, has excellent conductivity and spring characteristics, and is particularly excellent in resisting heat sagging due to heat generated when conducting electricity.

Inventors:

ISHIDA KIYOHITO (JP)
AKIZUKI TAKAYUKI (JP)

Application Number:

PCT/JP2011/078769

Publication Date:

June 21, 2012

Filing Date:

December 13, 2011

Export Citation:

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Assignee:

NIPPON SEISEN CO LTD (JP)
ISHIDA KIYOHITO (JP)
AKIZUKI TAKAYUKI (JP)

International Classes:

C22C9/06; C22C9/01; C22F1/08; F16F1/02; H01B1/02; H01B5/04; C22F1/00

Foreign References:

JP2006283107A	2006-10-19
JP2006291271A	2006-10-26
JPS58107464A	1983-06-27
JPH09143596A	1997-06-03
JP2006291271A	2006-10-26
JP2006283107A	2006-10-19

Other References: