Title:
COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2006/016624
Kind Code:
A1
Abstract:
A copper alloy, which has a chemical composition, in mass %, that Cu: 69 to 88 %, Si: 2 to 5 %, Zr: 0.0005 to 0.04 %, P: 0.01 to 0.25 %, and the balance: Zn, wherein with respect to [a] mass % representing the content of the element a, the relationships: f0 = [Cu]- 3.5[Si] - 3[P] = 61 to 71, f1 = [P]/[Zr] = 0.7 to 200, f2 = [Si]/[Zr] = 75 to 5000 and f3 = [Si]/[P] = 12 to 240 are satisfied, which has a metal structure wherein &agr phase and κ phase and/or &gammad phase are present and, with respect to [b] % representing the content of the phase b, the relationships: f4 = [&agr ] + [&gammad ] + [κ] ≥ 85 and f5 = [&gammad ] + [κ] + 0.3[μ] - [β] = 5 to 95 are satisfied, and which has an average crystal grain diameter of 200 μm or less in a macroscopic structure immediately after the solidification of a melt of the alloy.
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Inventors:
OISHI KEIICHIRO (JP)
Application Number:
PCT/JP2005/014691
Publication Date:
February 16, 2006
Filing Date:
August 10, 2005
Export Citation:
Assignee:
SANBO SHINDO KOGYO KABUSHIKI K (JP)
OISHI KEIICHIRO (JP)
OISHI KEIICHIRO (JP)
International Classes:
B22D1/00; C22C9/00; B22D21/00; B22D27/20
Foreign References:
| JPS59136439A | 1984-08-06 | |||
| JPS5837143A | 1983-03-04 | |||
| JP2004183056A | 2004-07-02 |
Other References:
See also references of EP 1777308A4
Attorney, Agent or Firm:
Miki, Hisami (3-8 Kyutaromachi 2-chome, Chuo-k, Osaka-shi Osaka, JP)
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