COPPER-BASE SINTERED SLIDING MATERIAL EXCELLENT IN SLIPPERINESS AND MACHINABILITY

Title:

COPPER-BASE SINTERED SLIDING MATERIAL EXCELLENT IN SLIPPERINESS AND MACHINABILITY

Document Type and Number:

WIPO Patent Application WO/1999/020806

Kind Code:

A1

Abstract:

A copper-base sliding material comprising a matrix made from sintered copper or alloy thereof and, dispersed therein, particles of A1N, Al¿2?O¿3?, NiB, Fe¿2?B, SiC, TiC, WC, Si¿3?N¿4?, Fe¿3?P, Fe¿2?P and/or Fe¿3?B, wherein the particles are dispersed after being regulated with respect to the hardness and quantity in such a manner that the weight percentage and average diameter of medium-hardness particles with Hv500 to 1000 are greater than those of higher-hardness particles with Hv1100 or above in order that the slipperiness and the machinability are both satisfactory.

Inventors:

KIRA TOSHIHIKO (JP)
YOKOTA HIROMI (JP)
KITAGAWA YOUICHIRO (JP)
SATO EICHI (JP)

Application Number:

PCT/JP1998/004685

Publication Date:

April 29, 1999

Filing Date:

October 16, 1998

Export Citation:

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Assignee:

TAIHO KOGYO CO LTD (JP)
KIRA TOSHIHIKO (JP)
YOKOTA HIROMI (JP)
KITAGAWA YOUICHIRO (JP)
SATO EICHI (JP)

International Classes:

B22F5/00; F16C33/10; B22F7/04; C22C1/10; C22C9/00; C22C9/04; C22C32/00; C23C24/08; F16C33/12; F16J1/01; (IPC1-7): C22C9/00

Foreign References:

JPH06271956A	1994-09-27
JPH07224370A	1995-08-22
JPH08253826A	1996-10-01

Other References: