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Patent Searching and Data


Title:
COPPER-BASED ALLOY MATERIAL FOR ELECTRONIC HARDWARE OF LOCOMOTIVE AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/029018
Kind Code:
A1
Abstract:
A copper-based alloy material for an electronic hardware of a locomotive and a preparation method thereof. The copper-based alloy material comprises, in percentage by weight, the following components: 0.3-0.7% of zinc, 0.3-0.7% of tin, 0.02-0.15% of manganese, and the balance of copper. The preparation method comprises smelting followed by casting drawing. The present invention ensures the electrical conductivity of an alloy material, increases the strength and hardness of the material, and improves the effect of an age-hardening treatment of the material. The material can be used in an environment at 400 C. The service life of the material in an electronic conductive part of a locomotive is extended.

Inventors:
SUN FEI (CN)
ZHAO YONG (CN)
ESSER SAI (CN)
ZOROESEF DENNIS (CN)
Application Number:
PCT/CN2017/108038
Publication Date:
February 14, 2019
Filing Date:
October 27, 2017
Export Citation:
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Assignee:
SUZHOU RICHMOND ADVANCED MATERIAL TECH TRANSFER CO LTD (CN)
International Classes:
C22C9/04; C22C1/02; C22C9/02
Foreign References:
CN1724700A2006-01-25
JPS62240731A1987-10-21
CN103555991A2014-02-05
Attorney, Agent or Firm:
LIAN & LIEN IP ATTORNEYS (CN)
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