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Title:
COPPER-BASED DEPOSITED ALLOY BOARD FOR CONTACT MATERIAL AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/032784
Kind Code:
A1
Abstract:
A copper-based deposited alloy board for contact material having differences between three tensile strengths, namely, tensile strength along the rolling direction, tensile strength along the direction sloping with an angle of 45° from the rolling direction and tensile strength along the direction sloping with an angle of 90° from the rolling direction, the maximum of the differences being 100 MPa or less. Further, there is provided a process for producing the copper-based deposited alloy board for contact material, comprising the step of applying aging heat treatment to a copper alloy board having undergone solution treatment.

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Inventors:
MIHARA KUNITERU (JP)
OHNO MASATO (JP)
TOKUHARA NAOFUMI (JP)
EGUCHI TATSUHIKO (JP)
Application Number:
PCT/JP2007/067840
Publication Date:
March 20, 2008
Filing Date:
September 13, 2007
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
MIHARA KUNITERU (JP)
OHNO MASATO (JP)
TOKUHARA NAOFUMI (JP)
EGUCHI TATSUHIKO (JP)
International Classes:
C22C9/06; B21B3/00; C22F1/00; C22F1/08; C25D7/00
Foreign References:
JPH09209062A1997-08-12
JP2006009137A2006-01-12
JP2006161148A2006-06-22
JP2005002400A2005-01-06
JP2006104539A2006-04-20
Attorney, Agent or Firm:
IIDA, Toshizo (1-10 Shimbashi 3-chome,Minato-ku, Tokyo 04, JP)
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