Title:
COPPER-BASED MICROCRYSTALLINE ALLOY, PREPARATION METHOD THEREOF, AND ELECTRONIC PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/134541
Kind Code:
A1
Abstract:
The present invention relates to a copper-based microcrystalline alloy, a preparation method thereof, and an electronic product. The copper-based microcrystalline alloy comprises, in weight percent, 30-60% of Cu, 25-40% of Mn, 4-6% of Al, 10-17 of Ni, 0.01-10% of Si, and 0.001-0.03% of Be, based on the total amount of the copper-based microcrystalline alloy.
Inventors:
GONG QING (CN)
GUO QIANG (CN)
WANG MENGDE (CN)
AN WEI (CN)
GUO QIANG (CN)
WANG MENGDE (CN)
AN WEI (CN)
Application Number:
PCT/CN2018/123023
Publication Date:
July 11, 2019
Filing Date:
December 24, 2018
Export Citation:
Assignee:
BYD CO LTD (CN)
International Classes:
C22C9/05; C22C1/02; C22C9/01; C22C9/06
Foreign References:
| CN105525134A | 2016-04-27 | |||
| CN102634691A | 2012-08-15 | |||
| CN104862524A | 2015-08-26 | |||
| CN1930315A | 2007-03-14 | |||
| EP2573198A1 | 2013-03-27 | |||
| JPH07138680A | 1995-05-30 |
Other References:
See also references of EP 3736351A4
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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