Title:
COPPER-BASED ROLLED ALLOY AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/148712
Kind Code:
A1
Abstract:
Disclosed is a copper-based rolled alloy having a copper-based alloy composition containing not less than 0.05% by mass but not more than 10% by mass of one or more elements selected from the group consisting of Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn. In this copper-based rolled alloy, the x-ray diffraction intensity ratio I(111)/I(200) of the (hkl) plane as measured in the rolled surface is not less than 2.0.
Inventors:
SAKAI TETSUO (JP)
MURAMATSU NAOKUNI (JP)
CHIBA KOKI (JP)
YAMAGAMI NAOKI (JP)
MURAMATSU NAOKUNI (JP)
CHIBA KOKI (JP)
YAMAGAMI NAOKI (JP)
Application Number:
PCT/JP2007/062378
Publication Date:
December 27, 2007
Filing Date:
June 20, 2007
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
UNIV OSAKA (JP)
SAKAI TETSUO (JP)
MURAMATSU NAOKUNI (JP)
CHIBA KOKI (JP)
YAMAGAMI NAOKI (JP)
UNIV OSAKA (JP)
SAKAI TETSUO (JP)
MURAMATSU NAOKUNI (JP)
CHIBA KOKI (JP)
YAMAGAMI NAOKI (JP)
International Classes:
C22C9/00; B21B1/22; B21B3/00; C22C9/01; C22C9/02; C22C9/05; C22C9/06; C22C9/10; C22F1/08; C22F1/00
Domestic Patent References:
WO2003064722A1 | 2003-08-07 | |||
WO2004022805A1 | 2004-03-18 |
Foreign References:
JP2006063431A | 2006-03-09 | |||
JP2001244400A | 2001-09-07 | |||
JP2001152303A | 2001-06-05 | |||
JP2001262224A | 2001-09-26 | |||
JP2006174419A | 2006-06-29 |
Other References:
PH. LEQUEU; J. J. JONAS, METALLUGICAL TRANSACTIONS A, vol. 19A, 1988, pages 105 - 120
1. GOKYU; K. SUZUKI; C. FUJIKURA, J. JAPAN INST. METALS, vol. 32, 1968, pages 742 - 747
T. SAKAI; SH. LEE; Y. SAITO, PROC. LIMAT2001, 2001, pages 311 - 316
T. SAKAI; K. YONEDA; Y. SAITO, MATERIAL SCIENCE FORUM, vol. 96-402, 2002, pages 309 - 314
T. SAKAI ET AL., JOURNAL OF THE JRICU, vol. 44, no. 1, 2005, pages 73 - 78
See also references of EP 2042613A4
1. GOKYU; K. SUZUKI; C. FUJIKURA, J. JAPAN INST. METALS, vol. 32, 1968, pages 742 - 747
T. SAKAI; SH. LEE; Y. SAITO, PROC. LIMAT2001, 2001, pages 311 - 316
T. SAKAI; K. YONEDA; Y. SAITO, MATERIAL SCIENCE FORUM, vol. 96-402, 2002, pages 309 - 314
T. SAKAI ET AL., JOURNAL OF THE JRICU, vol. 44, no. 1, 2005, pages 73 - 78
See also references of EP 2042613A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (9-26 Sakae 2-chome, Naka-k, Nagoya-shi Aichi 08, JP)
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