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Title:
COPPER-BASED ROLLED ALLOY AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/148712
Kind Code:
A1
Abstract:
Disclosed is a copper-based rolled alloy having a copper-based alloy composition containing not less than 0.05% by mass but not more than 10% by mass of one or more elements selected from the group consisting of Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn. In this copper-based rolled alloy, the x-ray diffraction intensity ratio I(111)/I(200) of the (hkl) plane as measured in the rolled surface is not less than 2.0.

Inventors:
SAKAI TETSUO (JP)
MURAMATSU NAOKUNI (JP)
CHIBA KOKI (JP)
YAMAGAMI NAOKI (JP)
Application Number:
PCT/JP2007/062378
Publication Date:
December 27, 2007
Filing Date:
June 20, 2007
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
UNIV OSAKA (JP)
SAKAI TETSUO (JP)
MURAMATSU NAOKUNI (JP)
CHIBA KOKI (JP)
YAMAGAMI NAOKI (JP)
International Classes:
C22C9/00; B21B1/22; B21B3/00; C22C9/01; C22C9/02; C22C9/05; C22C9/06; C22C9/10; C22F1/08; C22F1/00
Domestic Patent References:
WO2003064722A12003-08-07
WO2004022805A12004-03-18
Foreign References:
JP2006063431A2006-03-09
JP2001244400A2001-09-07
JP2001152303A2001-06-05
JP2001262224A2001-09-26
JP2006174419A2006-06-29
Other References:
PH. LEQUEU; J. J. JONAS, METALLUGICAL TRANSACTIONS A, vol. 19A, 1988, pages 105 - 120
1. GOKYU; K. SUZUKI; C. FUJIKURA, J. JAPAN INST. METALS, vol. 32, 1968, pages 742 - 747
T. SAKAI; SH. LEE; Y. SAITO, PROC. LIMAT2001, 2001, pages 311 - 316
T. SAKAI; K. YONEDA; Y. SAITO, MATERIAL SCIENCE FORUM, vol. 96-402, 2002, pages 309 - 314
T. SAKAI ET AL., JOURNAL OF THE JRICU, vol. 44, no. 1, 2005, pages 73 - 78
See also references of EP 2042613A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (9-26 Sakae 2-chome, Naka-k, Nagoya-shi Aichi 08, JP)
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