Title:
COPPER-BASED WIRE ROD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/106241
Kind Code:
A1
Abstract:
This copper-based wire rod is composed of copper or a copper alloy, and in a cross-section perpendicular to the longitudinal direction of the copper-based wire rod, the average crystal grain size is 20 μm to 150 μm, an accumulation rate of crystal orientation <111> is 40% or less, the Young's modulus is 80 GPa to 120 GPa, and 0.2% yield strength is 20 MPa to 90 MPa.
Inventors:
SEKIYA SHIGEKI (JP)
HASEGAWA KATSUMASA (JP)
KITAGAWA SHUICHI (JP)
MIHARA KUNITERU (JP)
KANEKO HIDEO (JP)
TAKAZAWA TSUKASA (JP)
HASEGAWA KATSUMASA (JP)
KITAGAWA SHUICHI (JP)
MIHARA KUNITERU (JP)
KANEKO HIDEO (JP)
TAKAZAWA TSUKASA (JP)
Application Number:
PCT/JP2022/044602
Publication Date:
June 15, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/00; C22C9/02; C22F1/00; C22F1/08; H01L21/60
Domestic Patent References:
| WO2016002770A1 | 2016-01-07 | |||
| WO2020183748A1 | 2020-09-17 | |||
| WO2020059856A1 | 2020-03-26 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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