COPPER CLAD FILM FOR MANUFACTURING A COPPER CLAD LAMINATE HAVING A CARRIER LAYER MADE OF AN ALUMINUM MATERIAL AND COPPER CLAD LAMINATE COMPRISING SAME

Title:

COPPER CLAD FILM FOR MANUFACTURING A COPPER CLAD LAMINATE HAVING A CARRIER LAYER MADE OF AN ALUMINUM MATERIAL AND COPPER CLAD LAMINATE COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2012/099430

Kind Code:

A2

Abstract:

Disclosed is a copper clad film for manufacturing a copper clad laminate, and a copper clad laminate comprising same. The copper clad film for use in manufacturing a copper clad laminate, in which copper clad is laminated onto a prepreg made of an insulating material, comprises: a copper clad layer to be bonded to the prepreg during the manufacture of the copper clad laminate; and a carrier layer which covers the copper clad layer so as to protect the copper lad layer during said bonding, and which is separated from the copper clad layer when forming a circuit pattern on the copper clad layer. The carrier layer is made of an aluminum material, and the copper clad layer is formed on the carrier layer by means of electroless plating.

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Inventors:

LEE, Mi Yeon (1 The Sharp Starpark, Jeongja-dong Bundang-gu, Seongnam-si, Gyeonggi-do 463-872, 463-872, KR)
이미연 (경기도 성남시 분당구 정자동 더샵스타파크, 463-872 Gyeonggi-do, 463-872, KR)
CHOI, Yung Ji (1 Yangji Maeul, Sunae-dong Bundang-gu, Seongnam-si, Gyeonggi-do 463-020, 463-020, KR)

Application Number:

KR2012/000515

Publication Date:

July 26, 2012

Filing Date:

January 19, 2012

Export Citation:

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Assignee:

LEE, Mi Yeon (1 The Sharp Starpark, Jeongja-dong Bundang-gu, Seongnam-si, Gyeonggi-do 463-872, 463-872, KR)
이미연 (경기도 성남시 분당구 정자동 더샵스타파크, 463-872 Gyeonggi-do, 463-872, KR)
CHOI, Yung Ji (1 Yangji Maeul, Sunae-dong Bundang-gu, Seongnam-si, Gyeonggi-do 463-020, 463-020, KR)

International Classes:

H05K1/09; B32B15/20

Attorney, Agent or Firm:

DANA PATENT LAW FIRM (5th Floor, BYC Bldg. 648-1,Yeoksam-dong, Gangnam-gu, Seoul 135-080, 135-080, KR)

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