Title:
COPPER CLAD LAMINATE FILM, ELECTRONIC ELEMENT INCLUDING SAME, AND METHOD FOR MANUFACTURING COPPER CLAD LAMINATE FILM
Document Type and Number:
WIPO Patent Application WO/2022/158831
Kind Code:
A1
Abstract:
Disclosed are a copper clad laminate film, an electronic element including same, and a method for manufacturing the copper clad laminate film. The copper clad laminate film includes a substrate structure in which a primer layer is disposed on at least one surface of a substrate; and a copper-containing layer disposed on the substrate structure, wherein the ratio (I[200]/I[311]) of the peak intensity of the [200] orientation plane to the peak intensity of the [311] orientation plane according to X-ray diffraction (XRD) analysis of the copper-containing layer may be at least 2.0. The copper clad-laminate film has low transmission loss at high frequency due to a low dielectric constant, a low dielectric loss, and a low surface roughness, and also has a high fatigue lifespan, and high room temperature adhesion and heat resistant adhesion between the substrate structure and the copper-containing layer. Accordingly, it is possible to prevent pattern peeling or deformation during a printed circuit process.
Inventors:
JUNG SEUNG MO (KR)
LEE HA SOO (KR)
LEE YONG HO (KR)
KANG HYUNG DAE (KR)
PARK JONG YONG (KR)
JUNG WOO DEUG (KR)
LEE HA SOO (KR)
LEE YONG HO (KR)
KANG HYUNG DAE (KR)
PARK JONG YONG (KR)
JUNG WOO DEUG (KR)
Application Number:
PCT/KR2022/000932
Publication Date:
July 28, 2022
Filing Date:
January 18, 2022
Export Citation:
Assignee:
TORAY ADVANCED MAT KOREA INC (KR)
International Classes:
H05K1/09; C08J7/043; C08J7/044; C09D5/00; C25D7/00; H01B5/14; H01B13/00; H05K3/38
Foreign References:
| KR20200037803A | 2020-04-09 | |||
| KR20120096032A | 2012-08-29 | |||
| KR20200129468A | 2020-11-18 | |||
| KR101715532B1 | 2017-03-10 | |||
| KR20200025801A | 2020-03-10 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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