Title:
COPPER-CLAD LAMINATE PLATE AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/027076
Kind Code:
A1
Abstract:
[Problem] To provide a copper-clad laminate plate in which the surface roughness of a polyimide film is reduced and in which warping during the manufacturing process is suppressed. [Solution] A copper-clad laminate plate according to the present invention comprises a polyimide film and a copper foil and is characterized in that the polyimide film contains a polyimide resin and liquid crystal polymer particles, and the long diameter, the short diameter, and the thickness of the liquid crystal polymer particles as defined below satisfy conditions (A) and (B): (A) the average value of elongation, which is the ratio of the long diameter and the short diameter, is not less than 1.2; and (B) the average value of flatness, which is the ratio of the short diameter and the thickness, is not less than 1.2.
Inventors:
NOBORI YUMIKO (JP)
NOGUCHI MASAKI (JP)
SONE HISASHI (JP)
NOGUCHI MASAKI (JP)
SONE HISASHI (JP)
Application Number:
PCT/JP2022/031742
Publication Date:
March 02, 2023
Filing Date:
August 23, 2022
Export Citation:
Assignee:
ENEOS CORP (JP)
International Classes:
B32B15/088; H05K1/03
Domestic Patent References:
| WO2017150336A1 | 2017-09-08 |
Foreign References:
| JP2021105149A | 2021-07-26 | |||
| JP2014111699A | 2014-06-19 | |||
| JP2008030464A | 2008-02-14 | |||
| JP2003200534A | 2003-07-15 | |||
| JP2021161185A | 2021-10-11 |
Attorney, Agent or Firm:
SORIMACHI Hiroshi et al. (JP)
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