Title:
COPPER-CLAD LAMINATE AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2017/169138
Kind Code:
A1
Abstract:
The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m·K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin.
Inventors:
IWAISAKO YASUSHI (JP)
ORITA TAKAHIRO (JP)
OOGAMI HIROYUKI (JP)
UENO YASUTSUGU (JP)
FURUKAWA KOUTARO (JP)
ORITA TAKAHIRO (JP)
OOGAMI HIROYUKI (JP)
UENO YASUTSUGU (JP)
FURUKAWA KOUTARO (JP)
Application Number:
PCT/JP2017/004417
Publication Date:
October 05, 2017
Filing Date:
February 07, 2017
Export Citation:
Assignee:
NIPPON TUNGSTEN (JP)
International Classes:
B32B15/08; B32B15/20; H01L33/62; H05K1/03; H05K1/05; H05K3/44
Domestic Patent References:
| WO2012165147A1 | 2012-12-06 |
Foreign References:
| JP2007284596A | 2007-11-01 | |||
| JP2011127074A | 2011-06-30 | |||
| JP2012116003A | 2012-06-21 |
Attorney, Agent or Firm:
EIWA PATENT FIRM (JP)
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