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Title:
COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL PROVIDED WITH RESIN
Document Type and Number:
WIPO Patent Application WO/2020/071287
Kind Code:
A1
Abstract:
One aspect of the present invention is a copper-clad laminate comprising an insulating layer and a copper foil that is present so as to be in contact with at least one surface of the insulating layer, wherein: the insulating layer includes a cured article of a resin composition containing a modified polyphenylene ether compound, which has a carbon-carbon unsaturated double bond and in which a terminal is modified by a substituent group; the amount of elemental chromium measured by X-ray photoemission spectroscopy in an exposed surface, at which the insulating layer is exposed by etching the copper-clad laminate using a copper chloride solution, is no more than 7.5 at% with respect to the amount of all elements measured by X-ray photoemission spectroscopy; and the surface roughness of the exposed surface is no more than 2.0 μm in terms of ten-point average roughness.

Inventors:
INOUE YUKI
ARISAWA TATSUYA
YAMAGUCHI SHUN
Application Number:
PCT/JP2019/038309
Publication Date:
April 09, 2020
Filing Date:
September 27, 2019
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B15/08; H05K1/09
Domestic Patent References:
WO2017122249A12017-07-20
WO2017033784A12017-03-02
Foreign References:
JP2007030326A2007-02-08
JP2011014647A2011-01-20
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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