COPPER-CLAD TWO-LAYER MATERIAL AND PROCESS FOR PRODUCING SAME

WIPO Patent Application WO/2013/125076

A1

A copper-clad two-layer material which comprises a polyimide film having a thickness of 12.5 µm or less and a copper layer with a thickness of 1-10 µm formed on one surface of the polyimide film by sputtering or electroplating, characterized in that the curliness of the two-layer material which occurs toward the polyimide side, with the copper layer outside, is 2 mm or less; and a process for producing the copper-clad two-layer material which comprises a polyimide film having a thickness of 12.5 µm or less and a copper layer with a thickness of 1-10 µm formed on one surface of the polyimide film by sputtering or electroplating, the process being characterized in that when the copper layer is formed on the polyimide film, the tension for unwinding the polyimide film and the tension for winding the polyimide film having the copper layer formed thereon are controlled to regulate the curliness of the two-layer material toward the polyimide side, with the copper layer outside, to 2 mm or less and to regulate the dimensional change to 0±0.1%. Thus, the copper-clad two-layer material, which comprises a polyimide film and a copper layer formed thereon by either sputtering or plating, has been reduced in curl amount and dimensional change.

SAKAGUCHI KAZUHIKO (JP)
ISHI KEIJI (JP)
HANAWA CHIKARA (JP)

PCT/JP2012/072689

August 29, 2013

September 06, 2012

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JX NIPPON MINING & METALS CORP (JP)
SAKAGUCHI KAZUHIKO (JP)
ISHI KEIJI (JP)
HANAWA CHIKARA (JP)

C23C28/02; B32B15/088; C25D5/56; C25D7/06; H05K1/03

WO2008065890A1

2008-06-05

JP2012001793A	2012-01-05
JP2006283044A	2006-10-19

OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)

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