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Title:
COPPER-CLAD TWO-LAYER MATERIAL AND PROCESS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/125076
Kind Code:
A1
Abstract:
A copper-clad two-layer material which comprises a polyimide film having a thickness of 12.5 µm or less and a copper layer with a thickness of 1-10 µm formed on one surface of the polyimide film by sputtering or electroplating, characterized in that the curliness of the two-layer material which occurs toward the polyimide side, with the copper layer outside, is 2 mm or less; and a process for producing the copper-clad two-layer material which comprises a polyimide film having a thickness of 12.5 µm or less and a copper layer with a thickness of 1-10 µm formed on one surface of the polyimide film by sputtering or electroplating, the process being characterized in that when the copper layer is formed on the polyimide film, the tension for unwinding the polyimide film and the tension for winding the polyimide film having the copper layer formed thereon are controlled to regulate the curliness of the two-layer material toward the polyimide side, with the copper layer outside, to 2 mm or less and to regulate the dimensional change to 0±0.1%. Thus, the copper-clad two-layer material, which comprises a polyimide film and a copper layer formed thereon by either sputtering or plating, has been reduced in curl amount and dimensional change.

Inventors:
SAKAGUCHI KAZUHIKO (JP)
ISHI KEIJI (JP)
HANAWA CHIKARA (JP)
Application Number:
JP2012/072689
Publication Date:
August 29, 2013
Filing Date:
September 06, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
SAKAGUCHI KAZUHIKO (JP)
ISHI KEIJI (JP)
HANAWA CHIKARA (JP)
International Classes:
C23C28/02; B32B15/088; C25D5/56; C25D7/06; H05K1/03
Domestic Patent References:
WO2008065890A12008-06-05
Foreign References:
JP2012001793A2012-01-05
JP2006283044A2006-10-19
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
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Claims: