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Patent Searching and Data


Title:
COPPER-CONTAINING PARTICLES, CONDUCTOR-FORMING COMPOSITION, METHOD FOR MANUFACTURING CONDUCTOR, CONDUCTOR AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/136753
Kind Code:
A1
Abstract:
Copper-containing particles comprising a copper-containing core particle and an organic material that exists in at least a part of the surface of the core particle, wherein the ratio of copper-containing particles having a major axis length not longer than 50 nm is not higher than 55% by number.

Inventors:
URASHIMA KOHSUKE (JP)
YONEKURA MOTOKI (JP)
KUMASHIRO YASUSHI (JP)
Application Number:
PCT/JP2016/055282
Publication Date:
September 01, 2016
Filing Date:
February 23, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B22F1/00; B22F1/054; B22F1/102; B82Y30/00; B82Y40/00; H01B1/22; H01B5/00; H01B13/00; B22F9/24
Foreign References:
JP2010018880A2010-01-28
JP2012126942A2012-07-05
JP2005240088A2005-09-08
JP2006265585A2006-10-05
JP2013133488A2013-07-08
JP2008024969A2008-02-07
JP2008169474A2008-07-24
JP2003342621A2003-12-03
JP2007224420A2007-09-06
JP2013072091A2013-04-22
Other References:
See also references of EP 3263248A4
Attorney, Agent or Firm:
Taiyo, Nakajima & Kato (JP)
Patent business corporation solar international patent firm (JP)
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