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Patent Searching and Data


Title:
COPPER DEPOSITION USING COPPER FORMATE COMPLEXES
Document Type and Number:
WIPO Patent Application WO2003053895
Kind Code:
A3
Abstract:
The present invention relates to novel copper formate complexes and the deposition of metallic copper on substrates or in or on porous solids using these novel copper complexes.

Inventors:
THOMPSON JEFFERY SCOTT
Application Number:
US0239637W
Publication Date:
January 15, 2004
Filing Date:
December 12, 2002
Export Citation:
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Assignee:
DU PONT (US)
International Classes:
C07D233/58; C07D213/18; C07D231/12; C07F1/00; C07F1/08; C23C18/02; C23C18/08; H05K3/10; (IPC1-7): C07F15/00; B05D1/18; B05D7/24; C23C18/00
Other References:
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; SLYUSARENKO, K. F. ET AL: "Synthesis and properties of some coordination compounds of copper(II) with 1,2-dimethylbenzimidazole", XP002258193, retrieved from STN Database accession no. 107:125790
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; BOREL, MARIE MADELEINE ET AL: "Carboxylatocopper(II) complex with a square structure: trans-diformatobis(2,6-dimethylpyridine)copper(II)", XP002258192, retrieved from STN Database accession no. 94:56262
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