COPPER ELECTROLYSIS SOLUTION CONTAINING COMPOUND HAVING SPECIFIC SKELETON AS ADDITIVE, AND ELECTROLYTIC COPPER FOIL PRODUCED THEREFROM

Title:

COPPER ELECTROLYSIS SOLUTION CONTAINING COMPOUND HAVING SPECIFIC SKELETON AS ADDITIVE, AND ELECTROLYTIC COPPER FOIL PRODUCED THEREFROM

Document Type and Number:

WIPO Patent Application WO/2006/080148

Kind Code:

A1

Abstract:

This invention provides a low profile electrolytic copper foil having a small surface roughness on the rough surface side (side remote from gloss surface) in the production of an electrolytic copper foil using a cathode drum, particularly an electrolytic copper foil which can realize fine patterning and has excellent elongation and tensile strength. There is also provided a copper electrolysis solution which can realize even copper plating on a two-layer flexible substrate without pinholes. The copper electrolysis solution contains, as an additive, a compound having a specific skeleton represented by general formula (1) produced by an addition reaction of a compound having one or more epoxy groups per molecule with water. (1) wherein A represents an epoxy compound residue; and n is an integer of 1 or more.

Inventors:

TSUCHIDA KATSUYUKI (JP)
KOBAYASHI HIRONORI (JP)
KUMAGAI MASASHI (JP)

Application Number:

PCT/JP2005/022662

Publication Date:

August 03, 2006

Filing Date:

December 09, 2005

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NIPPON MINING CO (JP)
TSUCHIDA KATSUYUKI (JP)
KOBAYASHI HIRONORI (JP)
KUMAGAI MASASHI (JP)

International Classes:

C25D3/38; C25D1/04; C25D7/00

Foreign References:

JP2004315945A	2004-11-11
JP2004107786A	2004-04-08
JPH10330983A	1998-12-15

Other References: