Title:
COPPER ELECTROLYSIS SOLUTION FOR PRODUCTION OF ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING ELECTROLYTIC COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2005/049895
Kind Code:
A1
Abstract:
A copper electrolysis solution for production of electrolytic copper foil, with which a foil of low roughness wherein the configuration and size of heaps of rough surface of deposited foil are uniformalized can be obtained while substantially inhibiting any occurrence of yielding of deposited foil attributed to control of the molecular weight and concentration of protein, etc.; and a process for producing an electrolytic copper foil with the use of the copper electrolysis solution. There is provided a copper electrolysis solution for production of electrolytic copper foil wherein a protein of 1000 to 2300 number average molecular weight Mn is contained in a concentration of 2 to 4.5 ppm. The Cu2+ concentration of the electrolysis solution is preferably in the range of 60 to 100 g/l. Further, the free SO42- concentration of the electrolysis solution is preferably in the range of 60 to 250 g/l. Still further, the Cl- concentration of the electrolysis solution is preferably in the range of 0.5 to 2.0 ppm. Moreover, there is provided a process for producing an electrolytic copper foil, wherein use is made of the above copper electrolysis solution for production of electrolytic copper foil.
Inventors:
SUGIMOTO AKIKO (JP)
Application Number:
PCT/JP2004/016728
Publication Date:
June 02, 2005
Filing Date:
November 11, 2004
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
SUGIMOTO AKIKO (JP)
SUGIMOTO AKIKO (JP)
International Classes:
C25D1/04; C25D3/38; C25D7/06; (IPC1-7): C25D3/38; C25D1/04
Foreign References:
| JPH0853789A | 1996-02-27 | |||
| JPH0649958B2 | 1994-06-29 | |||
| JPH0754183A | 1995-02-28 |
Attorney, Agent or Firm:
Yoshimura, Katsuhiro c/o Yoshimura International Patent Office Omiya Fbldg. (5-4 Sakuragicho 2-chome, Omiya-ku, Saitama-sh, Saitama 54, JP)
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