COPPER ELECTROLYTIC SOLUTION CONTAINING QUATERNARY AMINE COMPOUND POLYMER OF SPECIFIED SKELETON AND ORGANIC SULFUR COMPOUND AS ADDITIVES AND ELECTROLYTIC COPPER FOIL PRODUCED THEREWITH

WIPO Patent Application WO/2004/059040

A1

In the production of an electrolytic copper foil by means of a cathode drum, there is obtained a low-profile electrolytic copper foil having a low surface roughness on the roughened surface side (side opposite to glossy surface), especially an electrolytic copper foil that enables formation of fine pattern and excels in the tensile strength and elongation at ordinary and high temperatures. In particular, a copper electrolytic solution comprising a quaternary amine compound polymer, the quaternary amine compound polymer obtained by homopolymerization of an acrylic compound having a dialkylamino group whose nitrogen is quaternized or by copolymerization of the acrylic compound with another compound having unsaturated bond, and an organic sulfur compound as additives; and an electrolytic copper foil produced with the use of this copper electrolytic solution.

JP4470741	Electrode foil manufacturing equipment for electrolytic capacitors
JP2003511556	[Title of the Invention] A method for producing colloidal rod particles as a nanobar code.
WO/2014/073696	SURFACE-TREATED COPPER FOIL AND LAMINATE USING SAME

KUMAGAI MASASHI (JP)
HANAFUSA MIKIO (JP)

PCT/JP2003/011858

July 15, 2004

September 17, 2003

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NIKKO MATERIALS CO LTD (JP)
KUMAGAI MASASHI (JP)
HANAFUSA MIKIO (JP)

C25D1/04; C25D3/38; (IPC1-7): C25D1/04; C25D3/38

JPS6364519B2	1988-12-12
US4555315A	1985-11-26
EP1069211A2	2001-01-17

See also references of EP 1607495A4

Kagami, Norio (13-5 Akasaka 4-chom, Minato-ku Tokyo, JP)

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