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Title:
COPPER ELECTROLYTIC SOLUTION CONTAINING QUATERNARY AMINE COMPOUND POLYMER OF SPECIFIED SKELETON AND ORGANIC SULFUR COMPOUND AS ADDITIVES AND ELECTROLYTIC COPPER FOIL PRODUCED THEREWITH
Document Type and Number:
WIPO Patent Application WO/2004/059040
Kind Code:
A1
Abstract:
In the production of an electrolytic copper foil by means of a cathode drum, there is obtained a low-profile electrolytic copper foil having a low surface roughness on the roughened surface side (side opposite to glossy surface), especially an electrolytic copper foil that enables formation of fine pattern and excels in the tensile strength and elongation at ordinary and high temperatures. In particular, a copper electrolytic solution comprising a quaternary amine compound polymer, the quaternary amine compound polymer obtained by homopolymerization of an acrylic compound having a dialkylamino group whose nitrogen is quaternized or by copolymerization of the acrylic compound with another compound having unsaturated bond, and an organic sulfur compound as additives; and an electrolytic copper foil produced with the use of this copper electrolytic solution.

Inventors:
KUMAGAI MASASHI (JP)
HANAFUSA MIKIO (JP)
Application Number:
PCT/JP2003/011858
Publication Date:
July 15, 2004
Filing Date:
September 17, 2003
Export Citation:
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Assignee:
NIKKO MATERIALS CO LTD (JP)
KUMAGAI MASASHI (JP)
HANAFUSA MIKIO (JP)
International Classes:
C25D1/04; C25D3/38; (IPC1-7): C25D1/04; C25D3/38
Foreign References:
JPS6364519B21988-12-12
US4555315A1985-11-26
EP1069211A22001-01-17
Other References:
See also references of EP 1607495A4
Attorney, Agent or Firm:
Kagami, Norio (13-5 Akasaka 4-chom, Minato-ku Tokyo, JP)
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