Title:
COPPER FILM-FORMING AGENT AND METHOD FOR FORMING COPPER FILM
Document Type and Number:
WIPO Patent Application WO/2014/010328
Kind Code:
A1
Abstract:
The present invention is a copper film-forming agent containing a copper complex composed of methyl formate and a five- or six-membered nitrogen-containing heterocyclic compound having one to three nitrogen atoms, wherein the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in the substituent group is one to five, and elements other than carbon atoms in the compound are not bonded to hydrogen atoms.
Inventors:
IIDA SHUSAKU (JP)
MURAI TAKAYUKI (JP)
HIRAO HIROHIKO (JP)
MURAI TAKAYUKI (JP)
HIRAO HIROHIKO (JP)
Application Number:
PCT/JP2013/065108
Publication Date:
January 16, 2014
Filing Date:
May 30, 2013
Export Citation:
Assignee:
SHIKOKU CHEM (JP)
International Classes:
C23C18/08; H01B13/00
Foreign References:
| JP2012112022A | 2012-06-14 | |||
| JP2005513117A | 2005-05-12 | |||
| JP2009256218A | 2009-11-05 | |||
| JPS5217335A | 1977-02-09 | |||
| JP2005513117A | 2005-05-12 | |||
| JP2005002471A | 2005-01-06 | |||
| JP2005035984A | 2005-02-10 | |||
| JP2009256218A | 2009-11-05 |
Other References:
THERMOCHIMICA ACTA, vol. 98, 1986, pages 139 - 145
See also references of EP 2871260A4
See also references of EP 2871260A4
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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