Title:
COPPER FILM FORMING COMPOSITION AND PROCESS FOR MANUFACTURING COPPER FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/137013
Kind Code:
A1
Abstract:
Provided is a copper film forming composition which is in the form of a solution that is free from solid matter such as fine particles and which when applied to a substrate and treated by a flash lamp method using a xenon lamp, can form, at a low temperature and with low energy, a copper film that exhibits sufficient conductivity and high adhesion to the substrate. A copper film forming composition which comprises copper formate or a hydrate thereof, at least one diol compound selected from the group consisting of compounds represented by general formula (1) and compounds represented by general formula (1'), a specific dye compound, and an organic solvent that can dissolve these components and in which the diol compound is contained in an amount of 0.1 to 6.0mol/kg for every one mol/kg of the sum of the content of copper formate or a hydrate thereof and the content of copper acetate or a hydrate thereof.
Inventors:
ABE TETSUJI (JP)
SAITO KAZUYA (JP)
SAITO KAZUYA (JP)
Application Number:
PCT/JP2015/053068
Publication Date:
September 17, 2015
Filing Date:
February 04, 2015
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C23C18/14; H01B1/20; H01B13/00
Foreign References:
| JP2013194257A | 2013-09-30 | |||
| JP2010242118A | 2010-10-28 | |||
| JP2009256218A | 2009-11-05 | |||
| JP2012112022A | 2012-06-14 | |||
| JP2000328252A | 2000-11-28 | |||
| JPH07238382A | 1995-09-12 |
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
Kondo Toshihide child (JP)
Kondo Toshihide child (JP)
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