COPPER FINE PARTICLE DISPERSION LIQUID AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2007/013393

A1

Disclosed is a copper fine particle dispersion liquid containing copper fine particles having a particle size of not more than 100 nm and suitable as wiring material. This copper fine particle dispersion liquid is excellent in dispersibility and oxidation resistance, and enables to form a conductive film having excellent conductive characteristics and film formability by low-temperature firing. Specifically disclosed is a copper fine particle dispersion liquid composed of copper fine particles coated with a water-soluble polymer and a hydroxycarboxylic acid, a hydroxycarboxylic acid, and a polyhydric alcohol and/or a polar solvent. The copper fine particle dispersion liquid is produced as follows: a dispersion liquid obtained by dispersing copper fine particles, which are coated with a water-soluble polymer, in a polar solvent is added with a hydroxycarboxylic acid such as malic acid or citric acid or a solution thereof and stirred, thereby substituting a part of the water-soluble polymer with the hydroxycarboxylic acid; then the free water-soluble polymers are discharged by ultrafiltration; and then a hydroxycarboxylic acid and a polyhydric alcohol and/or a polar solvent are added thereinto.

MORI KENSAKU (JP)
OKAMOTO SHINTAROU (JP)
NAKATA HIROKO (JP)

PCT/JP2006/314566

February 01, 2007

July 24, 2006

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SUMITOMO METAL MINING CO (JP)
MORI KENSAKU (JP)
OKAMOTO SHINTAROU (JP)
NAKATA HIROKO (JP)

B22F9/00; B22F1/00; B22F1/0545; B22F1/102; C09D17/00; H01B1/00; H01B1/22

JPH10110123A

1998-04-28

OSHIDA, Yoshitaka et al. (3-12 Ginza 3-chom, Chuo-ku Tokyo 61, JP)

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