Title:
COPPER FOIL AND COPPER-CLAD LAMINATE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2018/047933
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper foil with which excellent adhesion, transmission characteristics, and heat resistance can be achieved and to provide a copper-clad laminate using the same. This copper foil is characterized in that when the characteristics of the adhesive surface of the copper foil are expressed using the number Wn of waves and roughness motif mean depth R which are calculated from a roughness motif determined by a motif method defined by JIS B0631:2000, the number Wn of waves is 11-30 per mm and the roughness motif mean depth R is 0.20-1.10 µm.
Inventors:
SATO AKIRA (JP)
UNO TAKEO (JP)
UNO TAKEO (JP)
Application Number:
PCT/JP2017/032411
Publication Date:
March 15, 2018
Filing Date:
September 08, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; B32B15/04; B32B15/20; C25D1/04; C25D5/12; C25D5/18; H05K1/09; H05K3/38
Domestic Patent References:
WO2015146981A1 | 2015-10-01 | |||
WO2013144992A1 | 2013-10-03 |
Foreign References:
JP2015042765A | 2015-03-05 | |||
JP2008285751A | 2008-11-27 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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