COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED USING SAME

Title:

COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED USING SAME

Document Type and Number:

WIPO Patent Application WO/2012/128099

Kind Code:

A1

Abstract:

The present invention provides both a copper foil which imparts excellent bendability when used in copper-clad laminates and a copper-clad laminate which is obtained using the copper foil. The copper foil has a thickness of 5-30 µm, has an I(220)/I(200) of 0.11 or less after annealed at 350ºC for 0.5 hours, and has a work hardening coefficient of 0.3-0.45 after annealed at 350ºC for 0.5 hours.

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Inventors:

NAKAMURO KAICHIRO (JP)

Application Number:

PCT/JP2012/056269

Publication Date:

September 27, 2012

Filing Date:

March 12, 2012

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP (JP)
NAKAMURO KAICHIRO (JP)

International Classes:

C22C9/00; B32B15/08; C22C9/02; C22C9/04; C22C9/06; C22C9/10; C22F1/08; H05K1/09; C22F1/00

Foreign References:

JP2006281249A	2006-10-19
JP2010227971A	2010-10-14
JP2006326684A	2006-12-07
JP2009185376A	2009-08-20

Attorney, Agent or Firm:

AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)

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Claims:

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