COPPER FOIL AND COPPER-CLAD LAMINATE PLATE USING SAME - JX Nippon Mining & Metals Corporation

Title:

COPPER FOIL AND COPPER-CLAD LAMINATE PLATE USING SAME

Document Type and Number:

WIPO Patent Application WO/2011/081044

Kind Code:

A1

Abstract:

Disclosed are copper foil with excellent bending ability when used in a copper-clad laminate plate, and a copper-clad laminate using said copper foil. The copper foil is 5-30μm thick, has surface roughness of Ra≦0.1μm in the direction parallel to the direction of rolling, and at 350°C has a work hardening exponent of 0.3 or greater and 0.45 or less 0.5 hours after annealing.

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Inventors:

NAKAMURO Kaichiro (JX Nippon Mining & Metals Corporation 1-1-2, Shiroganecho, Hitachi-sh, Ibaraki 56, 〒3170056, JP)

Application Number:

JP2010/072852

Publication Date:

July 07, 2011

Filing Date:

December 20, 2010

Export Citation:

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Assignee:

JX Nippon Mining & Metals Corporation (6-3 Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
ＪＸ日鉱日石金属株式会社 (〒64 東京都千代田区大手町二丁目６番３号 Tokyo, 〒1008164, JP)

International Classes:

B21B3/00; C22C9/00; C22C9/02; C22F1/08; C22F1/00

Attorney, Agent or Firm:

AKAO Kenichiro et al. (4kai, Kyobashi-Nichiei Biru 3-4, Kyobashi 3-chome, Chuo-k, Tokyo 31, 〒1040031, JP)

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