COPPER FOIL COMPLEX, COPPER FOIL USED IN COPPER FOIL COMPLEX, MOLDED BODY, AND METHOD FOR PRODUCING MOLDED BODY

Title:

COPPER FOIL COMPLEX, COPPER FOIL USED IN COPPER FOIL COMPLEX, MOLDED BODY, AND METHOD FOR PRODUCING MOLDED BODY

Document Type and Number:

WIPO Patent Application WO/2012/157469

Kind Code:

A1

Abstract:

[Problem] To provide a copper foil complex with improved bending properties and also provide a copper foil to be used in the copper foil complex. [Solution] A copper foil complex which is formed by laminating a copper foil and a resin layer, wherein the copper foil contains at least one element selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag in an amount of 30 to 500 ppm by mass in total, the tensile strength of the copper foil is 100 to 180 MPa, [I(200)/I0(200)] which is an integration degree at the (100) plane of the copper foil is 30 or more, and the average grain size viewed from the plate surface of the copper foil is 10 to 400 µm.

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Inventors:

KAMMURI KAZUKI (JP)

Application Number:

PCT/JP2012/061761

Publication Date:

November 22, 2012

Filing Date:

May 08, 2012

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP (JP)
KAMMURI KAZUKI (JP)

International Classes:

B32B15/08; B32B15/20; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C9/10; H05K1/03; H05K1/09; H05K9/00; C22F1/00; C22F1/08

Domestic Patent References:

WO2011004664A1	2011-01-13
WO2011004664A1	2011-01-13

Foreign References:

JP2006326684A	2006-12-07
JP2008088492A	2008-04-17
JP2009108376A	2009-05-21
JP2005068484A	2005-03-17
JP2003096526A	2003-04-03
JP2004360029A	2004-12-24
JPH07290449A	1995-11-07
JP3009383B2	2000-02-14
JP2002217507A	2002-08-02
JP2005015861A	2005-01-20
JP2005004826A	2005-01-06
JPH0732307B2	1995-04-10
JPH073237B2	1995-01-18

Other References: