COPPER FOIL COMPLEX - JX NIPPON MINING & METALS CORP

Title:

COPPER FOIL COMPLEX

Document Type and Number:

WIPO Patent Application WO/2012/008260

Kind Code:

A1

Abstract:

Disclosed is a copper foil complex which does not undergo the breakage of a copper foil arranged therein even when the complex is subjected to severe (complicated) deformation that is different from monoaxial bending such as press processing, and which has excellent processability. Specifically disclosed is a copper foil complex comprising a copper foil and a resin layer laminated on each other, wherein the requirement represented by formula (1): (f3×t3)/(f2×t2) ≥ 1 is fulfilled (wherein t2 (mm) represents the thickness of the copper foil; f2 (MPa) represents the stress of the copper foil at a tensile strain of 4%; t3 (mm) represents the thickness of the resin layer; and f3 (MPa) represents the stress of the resin layer at a tensile strain of 4%), and wherein the requirement represented by formula (2): 1 ≤ 33f1/(F×T) is fulfilled (wherein f1 (N/mm) represents the 180˚ peeling/adhesive strength between the copper foil and the resin layer; F (MPa) represents the strength of the copper foil complex at a tensile strain of 30%; and T (mm) represents the thickness of the copper foil complex).

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Inventors:

KANMURI KAZUKI (JP)

Application Number:

PCT/JP2011/063770

Publication Date:

January 19, 2012

Filing Date:

June 16, 2011

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP (JP)
KANMURI KAZUKI (JP)

International Classes:

B32B15/08; H05K1/02

Domestic Patent References:

WO2011004664A1

2011-01-13

Foreign References:

JPS59162044A	1984-09-12
JP2002249835A	2002-09-06
JP2010100887A	2010-05-06
JP2009111203A	2009-05-21
JP2007207812A	2007-08-16

Other References: