Title:
COPPER FOIL COMPLEX
Document Type and Number:
WIPO Patent Application WO/2012/008260
Kind Code:
A1
Abstract:
Disclosed is a copper foil complex which does not undergo the breakage of a copper foil arranged therein even when the complex is subjected to severe (complicated) deformation that is different from monoaxial bending such as press processing, and which has excellent processability.
Specifically disclosed is a copper foil complex comprising a copper foil and a resin layer laminated on each other, wherein the requirement represented by formula (1): (f3×t3)/(f2×t2) ≥ 1 is fulfilled (wherein t2 (mm) represents the thickness of the copper foil; f2 (MPa) represents the stress of the copper foil at a tensile strain of 4%; t3 (mm) represents the thickness of the resin layer; and f3 (MPa) represents the stress of the resin layer at a tensile strain of 4%), and wherein the requirement represented by formula (2): 1 ≤ 33f1/(F×T) is fulfilled (wherein f1 (N/mm) represents the 180˚ peeling/adhesive strength between the copper foil and the resin layer; F (MPa) represents the strength of the copper foil complex at a tensile strain of 30%; and T (mm) represents the thickness of the copper foil complex).
Inventors:
KANMURI Kazuki (JX Nippon Mining & Metals Corporation 1-1-2, Shiroganecho, Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2011/063770
Publication Date:
January 19, 2012
Filing Date:
June 16, 2011
Export Citation:
Assignee:
JX Nippon Mining & Metals Corporation (6-3 Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
ＪＸ日鉱日石金属株式会社 (〒64 東京都千代田区大手町二丁目６番３号 Tokyo, 〒1008164, JP)
ＪＸ日鉱日石金属株式会社 (〒64 東京都千代田区大手町二丁目６番３号 Tokyo, 〒1008164, JP)
International Classes:
B32B15/08; H05K1/02
Attorney, Agent or Firm:
AKAO Kenichiro et al. (4kai, Kyobashi-Nichiei Biru 3-4, Kyobashi 3-chome, Chuo-k, Tokyo 31, 〒1040031, JP)
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Claims: