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Title:
COPPER-FOIL COMPOSITE, FORMED BODY, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/105520
Kind Code:
A1
Abstract:
[Problem] To provide the following: an easily workable copper-foil composite wherein a copper foil is prevented from breaking even if subjected to a demanding (complex) deformation that differs from single-axis bending (such as press forming); a formed body; and a manufacturing method therefor. [Solution] A copper-foil composite comprising a copper foil and a resin layer laminated to each other. The thickness (t2, in mm) of the copper foil, the stress (f2, in MPa) in the copper foil at a tensile strain of 4%, the thickness (t3, in mm) of the resin layer, and the stress (f3, in MPa) in the resin layer at a tensile strain of 4% satisfy formula 1: (f3×t3)/(f2×t2) ≥ 1. The 180° peel adhesion strength (f1, in N/mm) between the copper foil and the resin layer, the strength (F, in MPa) of the copper-foil composite at a tensile strain of 30%, and the thickness (T, in mm) of the copper-foil composite satisfy formula 2: 1 ≤ 33f1/(F×T). A nickel layer and/or nickel-alloy layer with a total thickness of 0.001-5.0 µm are/is formed on the surface of the copper foil to which the resin layer is not laminated.

Inventors:
TANAKA KOICHIRO (JP)
KAMMURI KAZUKI (JP)
Application Number:
PCT/JP2013/050001
Publication Date:
July 18, 2013
Filing Date:
January 03, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B32B15/08; B32B15/20; H05K1/09
Domestic Patent References:
WO2011004664A12011-01-13
WO2012008260A12012-01-19
Foreign References:
JP2011210994A2011-10-20
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)
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Claims: