Title:
COPPER FOIL COMPOSITE, MOLDED BODY, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/105266
Kind Code:
A1
Abstract:
The objective of the present invention is to provide: a copper foil composite that prevents the copper foil from splitting even when subjected to extreme (complex) deformation differing from uniaxial bending such as press working or the like, has superior workability, and furthermore exhibits corrosion resistance and electrical contact performance stably over the long term; a molded body thereof; and a method for producing same. The copper foil composite results from a copper foil and a resin layer being laminated, when the thickness of the copper foil is t2 (mm), the stress on the copper foil at a tensile strain of 4% is f2 (MPa), the thickness of the resin layer is t3 (mm), and the stress on the resin layer at a tensile strain of 4% is f3 (MPa), formula 1, (f3×t3)/(f2×t2) ≥ 1, is satisfied, when the 180° peel (bond) strength between the copper foil and the resin layer is f1 (N/mm), the strength of the copper foil composite at a tensile strain of 30% of F (MPa), and the thickness of the copper foil composite is T (mm), formula 2, 1 ≤ 33f1/(F×T), is satisfied, and a Cr oxide layer adhered at 5-100 μg/dm2 is formed at the surface of the copper foil that is not laminated to the resin layer.
Inventors:
TANAKA KOICHIRO (JP)
KAMMURI KAZUKI (JP)
KAMMURI KAZUKI (JP)
Application Number:
PCT/JP2012/050591
Publication Date:
July 18, 2013
Filing Date:
January 13, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
TANAKA KOICHIRO (JP)
KAMMURI KAZUKI (JP)
TANAKA KOICHIRO (JP)
KAMMURI KAZUKI (JP)
International Classes:
B32B15/08; H05K1/02
Domestic Patent References:
| WO2012008260A1 | 2012-01-19 | |||
| WO2011121801A1 | 2011-10-06 | |||
| WO2011004664A1 | 2011-01-13 |
Foreign References:
| JP2011020264A | 2011-02-03 | |||
| JP2010100887A | 2010-05-06 | |||
| JP2009111203A | 2009-05-21 | |||
| JP2007207812A | 2007-08-16 |
Other References:
See also references of EP 2792483A4
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)
Ken-ichiro Akao (JP)
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Claims: