Title:
COPPER FOIL FOR FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/042663
Kind Code:
A1
Abstract:
Provided is a copper foil for a flexible printed wiring board having high thickness precision. The surface roughness (Ra) in the direction parallel to rolling has a mean value (Raavg) of 0.01 to 0.15 µm, and ΔRa=Ramax-Ramin is 0.025 µm or less.
Inventors:
NISHIDA SHUTARO (JP)
SAMEJIMA DAISUKE (JP)
NAKAMURO KAICHIRO (JP)
SAMEJIMA DAISUKE (JP)
NAKAMURO KAICHIRO (JP)
Application Number:
PCT/JP2012/073846
Publication Date:
March 28, 2013
Filing Date:
September 18, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
H05K1/09; C22C9/00; C25D7/06
Foreign References:
| JP2011136357A | 2011-07-14 | |||
| JP2009164588A | 2009-07-23 | |||
| JPH0328389A | 1991-02-06 | |||
| JP2006283146A | 2006-10-19 | |||
| JP2003193211A | 2003-07-09 | |||
| JP2006339304A | 2006-12-14 | |||
| JP2006336045A | 2006-12-14 | |||
| JP2006016690A | 2006-01-19 | |||
| JP2008248331A | 2008-10-16 | |||
| JP2009226435A | 2009-10-08 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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