Title:
COPPER FOIL HAVING ADHESIVE AGENT ADHERED THERETO, COPPER-CLAD LAMINATED PLATE, AND WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/179682
Kind Code:
A1
Abstract:
Provided are: a wiring substrate having a low dielectric constant and a low dielectric tangent; and a copper foil having an adhesive agent adhered thereto and a copper-clad laminated plate, each of which is suitable for the production of the wiring substrate and is improved in the adhesion to a copper foil. A copper foil having an adhesive agent adhered thereto, which comprises a copper foil and an adhesive agent layer provided on one surface of the copper foil, wherein the copper foil has, on one surface thereof, a roughened surface of which the surface is treated with methacryl silane, acryl silane or isocyanurate silane, the adhesive agent layer is made of a resin composition containing, as the main component, a modified polyphenylene ether in which a hydroxyl group located at an end of the main chain is modified with an ethylenically unsaturated compound, and the adhesive agent layer is formed on the roughened surface.
Inventors:
UCHIDA KAZUMICHI (JP)
Application Number:
PCT/JP2018/000824
Publication Date:
October 04, 2018
Filing Date:
January 15, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/38; B32B15/08; B32B15/20; C09J4/00; C09J7/20; C09J11/06; C09J153/02; C09J171/00; H05K1/03
Domestic Patent References:
| WO2013105650A1 | 2013-07-18 |
Foreign References:
| JP2016028885A | 2016-03-03 | |||
| JP2005015613A | 2005-01-20 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
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